Morse Micro is making headlines with its latest announcement at The Things Conference. The company has entered the next phase of IoT innovation by launching mass production of its new MM8108 Wi-Fi HaLow SoC, as well as introducing new development kits and evaluation platforms to further empower developers and businesses worldwide. This move promises to accelerate the advancement and deployment of long-range, low-power IoT solutions.
Morse Micro Launches Mass Production of MM8108 Wi-Fi HaLow SoC
Morse Micro has officially started mass production of its second-generation MM8108 System-on-Chip (SoC). This SoC delivers Wi-Fi HaLow with unmatched data throughput—even at extended ranges—paving the way for the next wave of IoT and edge AI solutions. The MM8108 stands out due to its capacity to deliver connection speeds up to 43Mbps across long distances. This breakthrough enables new possibilities for industrial automation, smart cities, and household IoT applications. According to Morse Micro’s leadership, this technology sets the stage for “IoT 2.0”—an era defined by seamless, reliable, and far-reaching connectivity.
Expanded Module Options and Evaluation Kits Now Available Globally
To support the new SoC, Morse Micro is releasing a range of modules and evaluation kits now shipping worldwide. Some highlights include:
- MM8108-EKH01: Integrates the MM8108 SoC with a Raspberry Pi 4, using Broadcom’s BCM2711 and running Linux
- MM8108-EKH05: Features MM8108 combined with ST Microelectronics’s STM32U585 on a FreeRTOS-based IoT platform
- MM8108-EKH19: Offers a USB-A dongle solution paired with GLi.net’s GL-MT3000 Wi-Fi 6 router
Modules are readily accessible through distributors like Mouser Electronics. Moreover, partnerships with companies such as AzureWave, Vantron, and Quectel enable customers to choose from a variety of solutions. This rapidly expanding ecosystem ensures faster go-to-market opportunities and gives device manufacturers the flexibility to select the right module for their specific needs.
HaLowLink 2 Platform Simplifies Adoption of Wi-Fi HaLow Networks
Morse Micro is also launching HaLowLink 2, its next-generation evaluation platform designed to accelerate Wi-Fi HaLow integration. Building on the success of the earlier version, HaLowLink 2 uses the MM8108 SoC and delivers throughput up to 43Mbps at extended range, benefiting from advanced modulation and higher internal power amplification. Expected to be widely available in the first quarter of 2026, HaLowLink 2 targets markets in the US, EU, UK, Canada, Japan, and Australia. This platform is engineered to help developers easily evaluate, prototype, and deploy long-range IoT networks, simplifying every stage from concept to scale.
In summary, Morse Micro’s mass production of the MM8108 SoC, new module offerings, and the HaLowLink 2 platform signal a transformative leap forward for IoT connectivity. By providing robust solutions for developers and manufacturers, Morse Micro is not only advancing Wi-Fi HaLow adoption but also paving the way for a smarter, more connected future across industries and households.
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